The POU3500 method offers dynamic temperature Charge of the method chamber cathode / electrode / anode and may be synchronized with any more info etch method.
Tool & TCU program calibration strategies vary external examination devices not employed on a regular basis for verifying
While using the POU3500, you'll be able to accomplish unparalleled leads to etch overall performance, chamber uptime, lessened price of possession and fab Place utilization – all while improving your process trustworthiness.
initially founded in 1985, our company has grown right into a acknowledged chief in furnishing temperature Regulate systems to the global semiconductor field.
LAUDA-Noah will, for the customer's retrofit analysis, watch and modify its fluid temperature control profiles to match an current TCUs' as a way to ensure a sleek method integration via DAQ.
The accuracy on the POU 3300 allows for independent control of the method fluid temperature towards the wafer chuck within just +/- 0.one °C of set position, plus the quick response time from the procedure permits for max wafer-to-wafer repeatability through the entire etch procedure.
The accuracy of your POU 3500 permits unbiased Charge of the procedure fluid temperature for the wafer chuck in just +/- 0.1 °C of established place, as well as the speedy response time with the process makes it possible for for maximum wafer-to-wafer repeatability all through the etch procedure.
With our unit strategically mounted roughly 6 feet from the chamber, we achieve a much more exact reading with the chuck temperature. This method ensures constant temperature through the entire production large amount, leading to enhanced wafer-to-wafer CD uniformity.
The data pertains to some 300mm chamber temperature profile all through a high component ratio Etch approach, running at extremely high RF electricity conditions (~three.8kW). The persuasive facets of this data set are:
Dynamic Temperature Manage, as carried out in programs just like the LAUDA-Noah POU, is definitely an solution that senses the temperature of the method fluid getting back from the method chamber’s wafer chuck (ESC) and dynamically adjusts the temperature of the provided process fluid determined by this genuine-time suggestions.
The TEs' can switch straight from heating to cooling, or visa-versa. They can switch on & off while inside the heating or cooling mode and may boost or lower the quantity of heating or cooling without switching in anyway.
The POU3300 technique offers dynamic temperature Charge of the procedure chamber cathode / electrode / anode and can be synchronized with any etch approach.
The reality is that legitimate Dynamic Temperature Manage can only be achieved when all five (5) of the following program style and installation requirements are fulfilled:
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We demand much less cooling/heating capacity for the same software for a static TCU on account of our tiny reservoir quantity.